Mountable integrated circuit package system with substrate

Details Mountable integrated circuit package system with substrate Mountable integrated circuit package system with substrate

2008-03-25

2010-12-21

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S698000, C257SE25006, C257SE25013, C257SE25017, C257SE25021, C257SE25027, C257SE23001, C257SE23013, C257SE23145

Reexamination Certificate

active

07855444

ABSTRACT:
A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting the external leadfinger and the substrate.

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