Mountable integrated circuit package-in-package system

Details Mountable integrated circuit package-in-package system Mountable integrated circuit package-in-package system

2011-07-12

2011-07-12

Nguyen, Thanh (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S687000, C257S737000, C257SE23079

Reexamination Certificate

active

07977779

ABSTRACT:
A mountable integrated circuit package-in-package system includes: providing an interface integrated circuit package system with a terminal having a plated bumped portion of an inner encapsulation; mounting the interface integrated circuit package system over a package carrier with the terminal facing away from the package carrier; connecting the package carrier and a pad extension of the terminal; and forming a package encapsulation over the interface integrated circuit package system with the terminal exposed.

REFERENCES:
patent: 6072239 (2000-06-01), Yoneda et al.
patent: 6191494 (2001-02-01), Ooyama et al.
patent: 6774449 (2004-08-01), Nishii et al.
patent: 7687897 (2010-03-01), Ha et al.
patent: 2007/0187826 (2007-08-01), Shim et al.
patent: 2007/0257348 (2007-11-01), Yang

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