Mount for semiconductor light emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S084000, C257S093000, C257S098000

Reexamination Certificate

active

06876008

ABSTRACT:
A device includes a submount, and a semiconductor light emitting device mounted on first and second conductive regions on a first side of the submount in a flip chip architecture configuration. The submount has third and fourth conductive regions on a second side of the submount. The third and fourth conductive regions may be used to solder the submount to structure such as a board, without the use of wire bonds. The first and third conductive regions are electrically connected by a first conductive layer and the second and fourth conductive regions are electrically connected by a second conductive layer. The first and second conductive layers may be disposed on the outside of the submount or within the submount.

REFERENCES:
patent: 6114716 (2000-09-01), Boles et al.
patent: 6150197 (2000-11-01), Boles et al.
patent: 6486499 (2002-11-01), Krames et al.
patent: 20020070387 (2002-06-01), Wang et al.
patent: 20020070449 (2002-06-01), Yagi et al.
patent: 20030094622 (2003-05-01), Horiuchi et al.
patent: 20030222270 (2003-12-01), Uemura
patent: 20040026708 (2004-02-01), Chen
patent: WO 9959206 (1999-11-01), None
U.S. Appl. No. US 2003/0085416 A1, Publication Date: May 8, 2003.

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