Moulding compounds for the production of inorganic sintered moul

Compositions: ceramic – Ceramic compositions – Carbide or oxycarbide containing

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501 88, 501 96, 501102, 501126, 501127, 501134, 264 63, C04B 3552

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052832139

ABSTRACT:
A moulding compound is described which contains an inorganic powder together with a binder system. The binder system contains a thermoplast having a melting temperature greater than 180.degree. C. A process is also described for making a sintered molding from the molding compound, which process includes the steps of injection moulding, removal of the binder by heating, and sintering.

REFERENCES:
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patent: 4671912 (1987-06-01), Komatsu et al.
patent: 5086093 (1992-02-01), Miller
patent: 5128399 (1992-07-01), Mochizuki
Derwent Database, JP 56 136 838, Oct. 26, 1981.
Derwent Database, JP 561 010 067, Jan. 17, 1986.
Technische Keramik, pp. 206-210, (1990).
Edirisinghe et al., Int. J. High Technology Ceramics, 2:1-31 (1986).
Edirisinghe et al., Int. J. High Technology Ceramics, 2:249-278 (1986).

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