Moulding compositions including unsaturated polyesters and an am

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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260 75UA, 260860, C08G 6354, C08G 6368

Patent

active

040691934

ABSTRACT:
Molding composition comprising an inert filler, from 0.2 to 2 wt.% of an organic peroxide with a decomposition temperature above 70.degree. C, from 0.5 to 10 wt.% of an amide of an unsaturated aliphatic carboxylic acid, and from 10 to 50 wt.% of unsaturated polyester A and/or unsaturated polyester B, wherein said polyester A is the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof with an unsaturated dicarboxylic acid, and said polyester B is the polycondensation product of an alkylene glycol with an unsaturated dicarboxylic acid and a saturated dicarboxylic acid.
The resulting molded articles are particularly useful in the electrical and electronic fields.

REFERENCES:
patent: 2879249 (1959-03-01), Raichle et al.
patent: 3467619 (1969-09-01), Raichle et al.

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