Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1987-07-01
1990-03-27
Eley, Timothy V.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
361414, H05K 100
Patent
active
049122886
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
This invention relates to the manufacture of electrical circuits formed on a surface of a substance of insulating plastics material.
Modern, so-called "engineering plastics", are increasingly being used as parts, sub-assemblies or structural members in all kinds of manufactured goods; such as motor cars, aircraft, "white" goods, telecommunications equipment. There is often a requirement to incorporate an electrical circuit on such parts and, hitherto, this has been achieved by printing, bonding or otherwise applying the circuit onto the surface of such parts to effectively produce a "printed" circuit on an external surface of a three-dimensional object. The printed circuit may include integrally formed resistors, capacitors and inductors and may also have other devices added to the circuit.
Electrical circuits of this kind can only be applied to an external surface of an object, are prone to physical damage and can exhibit the undesirable characteristics of inter-conductor contamination by handling, solder flux residues and accumulated debris, such as dust, in use, which will all reduce the insulation resistance and dielectric properties or give rise to variation in these properties.
U.S. Pat. No. 4,415,607 (Denes et al); assigned to the Assignee of this application, discloses a method of making a printed circuit network device including the steps of depositing an insulating primary substrate layer (a screen printed layer of titanium dioxide loaded epoxy resin dissolved in a combined butyl Cellosolve acetate and n-butanol solvent) on a temporary support structure having a release surface (a super-calendered, clay-coated one side natural kraft paper, coated on the clay side with a silicone release coating), applying to the exposed surface of the primary substrate layer certain defined conductor areas, (screen printed conductive ink using the same epoxy resin based vehicle loaded with a conductive material), mounting the temporary support member with its several layers (together forming a decalcomania) in facing relationship with a permanent support member, and thereafter releasing a removing the temporary support member from the mounted primary support layer.
The sole given application is for the production of printed circuit network devices incorporating resistive paths and, for this, the method additionally comprises the steps of applying defined resistor areas on the exposed surface of the primary substrate layer and in electrical connection with the conductor areas and trimming the respective resistor areas to a predetermined resistive value. An insulating permanent base or support being injection moulded directly to the decalcomania.
SUMMARY OF THE INVENTION
The present invention is an extension and adaptation of the method of the above-identified application with the object of embedding a circuit pattern of electro-conductive or electro-resistive material in or within any surface of a three-dimensionally shaped substrate of insulating plastics material.
According to the present invention, a method of providing an electrical circuit on a surface of a three-dimensionally dimensionally shaped substrate of insulating plastics material, comprises the sequential or non-sequential steps of: with a circuit pattern of electro-conductive or electro-resistive, heat-resistant synthetic resin applied to at least one face thereof; and insulating plastics material against the unsupported face of the carrier; the moulded substrate.
Surfaces with embedded circuits produced by this method have the advantages of the circuit being protected against physical damage, improved or constant electrical characteristics (because there is no volume between proud circuit elements to accumulate debris of one form or another).
According to one embodiment of the present invention, a three-dimensionally formed, patterned carrier is inserted in a mould cavity with a face of the carrier supported on a surface of the mould cavity having a shape complementary to that of the formed carrier and the mould cavi
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Atkinson Anthony
Denes Oscar L.
Gray Richard
Allen-Bradley International Limited
Eley Timothy V.
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