Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Reexamination Certificate
2007-05-01
2007-05-01
Lee, Edmund H. (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
Direct application of fluid pressure differential to...
Producing multilayer work or article
C264S272150, C264S275000, C425S129100, C425S546000, C425S572000, C425S573000, C425S589000
Reexamination Certificate
active
09743155
ABSTRACT:
The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising: at least two mould parts displaceable relative to each other, at least one of which is provided with a recess, and feed means for encapsulating material, wherein at least one of the mould parts is provided with a runner which connects on one side to a wall of a mould part co-defining a mould cavity and connects on the other side to a side of the mould part remote from the mould cavity. The invention also relates to an encapsulating device of which such a mould forms parts, and to a method for encapsulating electronic components mounted on a carrier.
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Antonius Tomassen Marcel Gerardus
Claassen Antonius Bernardus
Fico B.V.
The Webb Law Firm
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