Motor control unit with thermal structure

Details Motor control unit with thermal structure Motor control unit with thermal structure

1995-05-09

1996-04-16

Sterrett, Jeffrey L.

Electric power conversion systems

Current conversion

With cooling means

361700, 361715, 174 152, 165 803, H05K 720

Patent

active

055089089

ABSTRACT:
A motor control unit having a first semiconductor module circuit for converting an alternating current into a direct current, a second semiconductor module circuit consisting of switching elements for converting the direct current into an alternating current of optional voltage and frequency, and a control circuit for controlling the semiconductor module circuits. The unit has a case that is substantially rectangular in cross section, vertically high and laterally thin with respect to a perpendicular installation surface. Two heat sinks are disposed at the outside of the unit case at the back thereof and are thermally connected to a laminar heat plate that is disposed within the case and in contact with the heat dissipating installation surfaces of the semiconductor modules inside the unit case.

REFERENCES:
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 4399486 (1983-08-01), Petsch
patent: 4503483 (1985-03-01), Basiulis
patent: 4992925 (1991-02-01), Meyer
IBM Technical Disclosure Bulletin, vol. 18, No. 12, May 1976, pp. 3982-3983 "Heat-Pipe Cooled Stacked Electronic Wafer Package", Q. K. Kerjilian and R. N. Spaight.

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