Motion detector and method of producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257S666000, C257SE23039, C257SE23031, C073S504120, C073S514010

Reexamination Certificate

active

10849578

ABSTRACT:
A method of producing an electronic device electrically and mechanically couples an integrated circuit to a leadframe to produce an intermediate assembly. At least a portion of the intermediate assembly then is encapsulated with a molten encapsulating material. After it is encapsulated, the method permits the molten encapsulating material to substantially solidify. A method of detecting the orientation of a sensor as mounted to an external object also is disclosed.

REFERENCES:
patent: 5939633 (1999-08-01), Judy
patent: 6505511 (2003-01-01), Geen et al.
patent: 2004/0163470 (2004-08-01), Babala et al.

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