Motherboard stiffener and guide for processor modules and PCI ca

Details Motherboard stiffener and guide for processor modules and PCI ca Motherboard stiffener and guide for processor modules and PCI ca

1997-06-09

1998-11-24

Gibson, Jr., Robert W.

Supports: racks

Special article

Platelike

211 26, 361796, 361802, H05K 714

Patent

active

058395849

ABSTRACT:
A structural foam, injection molded superstructure is attached to a motherboard by means of threaded inserts. The superstructure is formed with guide ways for CPU processor modules, and also for the edges of PCI cards. Features of the structure include cam levers on the CPU modules to install and extract the modules. A metal transverse vertical retaining bracket is attached to the superstructure to hold sides thereof parallel and prevent splaying of the free, open end of the superstructure upon extraction of CPU processor modules. The assembly provides stiffness to the motherboard.

REFERENCES:
patent: 5214572 (1993-05-01), Cosimano et al.
patent: 5317483 (1994-05-01), Swindler
patent: 5377080 (1994-12-01), Lin
patent: 5394305 (1995-02-01), Woral et al.
patent: 5594627 (1997-01-01), Le
patent: 5642263 (1997-06-01), Lauruhn
patent: 5708563 (1998-01-01), Cranston, III et al.
patent: 5734551 (1998-03-01), Hileman et al.

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