Motherboard heat sink passage and support board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S689000, C361S692000, C361S695000, C174S016300, C165S080300, C165S104330, C165S185000, C165S104340, C257S721000, C257S722000

Reexamination Certificate

active

06411511

ABSTRACT:

BACKGROUND OF THE INVENTION
(a) Field of the Invention
The present invention relates to an auxiliary board functioning as a heat sink passage and as a support to an industrial computer motherboard, and more particularly to one that can be plugged into a slot of a backplane of said computer. A recessed frame on said auxiliary board covers up a CPU heat sink on the motherboard having both winds of said recessed frame to merely contact the motherboard as a support to relief moment applied to the motherboard due to biased central gravity so to ensure normal operation of the CPU on the motherboard. A passage formed between the motherboard and the recessed frame for a fan provided at one end of said wings to effectively dissipate the heat from the CPU heat sink.
(b) Description of the Prior Art
As illustrated in
FIG. 1
, a backplane
20
is provided inside a casing
10
of an industrial computer. A plurality of slots
21
in different specifications are provided on said backplane
20
to receive plug-in by interface cards of various specifications (in this preferred embodiment of the present invention, a motherboard interface card is plugged in, and to be referred hereinafter to as the motherboard
30
). A fixation guide way
111
corresponding to said slot
21
is provided on a sidewall inside said casing
10
for one end of said motherboard
30
to slide in, thus to restrict a mobile recessed frame of said motherboard
30
. A standard port
31
, e.g. PS/2, parallel port, serial port, USB, etc., provided on the other end of said motherboard
30
may be fixed with a screw into a through hole
121
on a rear panel
12
of the casing. However, the faster of data process signaled by CPU chip (not illustrated) on the motherboard
30
, the more heat will be generated during the operation. Said heat is transmitted to a CPU heat sink
32
. Therefore, higher heat dissipation efficiency is demanded on a fan
33
to avoid downtime by the computer due to overheated CPU chip. To solve this problem, usually larger capacity of the fan
33
is used to improve heat dissipation efficiency. However, the larger fan means more burden of weight in relation to the motherboard
30
. As a result, after the insertion part
34
(so-called “golden finger”) at the base of the motherboard is plugged into the slot
21
on the backplane
20
, said CPU heat sink
32
and the fan
33
creates biased central gravity upon the motherboard
30
, resulting in a bending moment to the motherboard
30
. Said bending moment often causes poor contact to the slot
21
on the backplane
20
, and directly strips off the solder points distributed over the electronic circuit on the motherboard
30
to affect the normal performance of the motherboard
30
.
SUMMARY OF THE INVENTION
The primary purpose of the present invention is to provide an auxiliary board to support a CPU heat sink disposed at the side of a motherboard. A recessed frame comprised of a base plate and wings with said wings kept away from each other for a certain spacing with the recess facing said heat sink disposed on the motherboard. Said wings merely touching the motherboard to relieve the burden of the weight of the CPU heat sink to eliminate the possible displacement of the center gravity of the motherboard, thus to ensure normal operation of the CPU on the motherboard.
Another purpose of the present invention is to provide an auxiliary board to reduce the burden of the weight of a fan for the motherboard by having removed the fan otherwise having been fixed onto the motherboard to one end of the recessed frame of the auxiliary board.
Another purpose yet of the present invention is to provide an auxiliary board to improve heat dissipation rate for the CPU heat sink on the motherboard. To achieve the purpose, the CPU heat sink accommodated by the recessed frame forms a heat sink passage with the motherboard. Cool air from the fan disposed at one end of the recessed frame is collected for the heat transmitted from CPU chip to the CPU heat sink and can be easily driven out of the passage.
Another purpose of the present invention is to provide an auxiliary board to reduce the space occupied by the fan in the slot on the backplane. To achieve this purpose, the fan originally disposed on the CPU heat sink is moved to one end of the wings of the recessed frame. By doing so, more space in the slot is available for those interface cards that will not interfere with plug-in location.


REFERENCES:
patent: 5079438 (1992-01-01), Heung
patent: 5136465 (1992-08-01), Benck et al.
patent: 5338214 (1994-08-01), Steffes et al.
patent: 5852547 (1998-12-01), Kitlas et al.
patent: 5854738 (1998-12-01), Bowler
patent: 5936836 (1999-08-01), Scholder
patent: 6002586 (1999-12-01), Chen et al.
patent: 6259600 (2001-07-01), Talbot et al.
patent: 6282090 (2001-08-01), Johnson et al.

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