Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,...
Reexamination Certificate
2007-01-09
2007-01-09
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Reexamination Certificate
active
11142074
ABSTRACT:
A motherboard (100) in accordance with a preferred embodiment includes an audio connection area (10) defining a first jack layout (12). The first jack layout integrates second and third jack layouts for two audio connectors of different specifications, so that jacks (121, 122) of the first jack layout can selectively connect with the audio connectors.
REFERENCES:
patent: 5064378 (1991-11-01), Olson et al.
patent: 5751557 (1998-05-01), Silva
patent: 5788511 (1998-08-01), Burnworth et al.
patent: 6438637 (2002-08-01), Chen
patent: 6612850 (2003-09-01), Dai
patent: 6761584 (2004-07-01), Li
patent: 2004/0037426 (2004-02-01), Chu et al.
Chen Jin-Xing
Jiang Zhi-Hui
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Precision Industry Co., Ltd.
Morris Manning & Martin LLP
Paumen Gary F.
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