1977-05-17
1979-03-06
Wojciechowicz, Edward J.
357 41, 357 42, 357 59, 357 91, H01L 2978
Patent
active
041433882
ABSTRACT:
A MOS type semiconductor device, wherein at least one oblique face is provided on at least a part of a gate electrode which is provided on a principal face of said substrate with a gate insulation film inbetween, and at a specific depth from the oblique face, that is, in parallel with this oblique face, an ion-implanted layer is provided in a manner to obliquely cross the surface of said substrate. In this MOS type semiconductor device the channel is made immediately underneath the surface of the substrate and in the ion-implanted layer, and therefore the channel length is determined by the thickness of the ion-implanted layer. By controlling the thickness of the ion-implanted layer, a short channel length, which is required for improving the operating speed and/or the handling current capability of MOS type semiconductor devices, is obtainable.
REFERENCES:
patent: 3860454 (1975-01-01), Witt et al.
patent: 3897274 (1975-07-01), Stehlin et al.
patent: 4029522 (1977-06-01), De La Moneda
Esaki Hideya
Hirao Takashi
Kawakami Hakuhei
Matsushita Electric - Industrial Co., Ltd.
Wojciechowicz Edward J.
LandOfFree
MOS type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with MOS type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MOS type semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-924032