Morphing fillers and thermal interface materials

Details Morphing fillers and thermal interface materials Morphing fillers and thermal interface materials

2008-01-01

2008-01-01

Cain, Edward J. (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S434000, C524S439000, C257SE23106, C257SE23107, C257SE23109

Reissue Patent

active

RE039992

ABSTRACT:
A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.

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