Monolithic pressure sensitive integrated circuit

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357 40, 357 51, 357 55, 73727, H01L 2984, H01L 2996

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active

048856215

ABSTRACT:
A monolithic pressure sensitive silicon integrated circuit is formed by first providing a localized etch-stop layer on one surface of the silicon chip, then growing successive epitaxial layers of opposite conductivity types over this surface. In the upper of the two layers, there is formed a bridge of four piezoresistors overlying the periphery of the etch-stop layer and the conditioning circuitry for amplifying the output of the bridge including both lateral and vertical junction transistors. The back surface of the chip is etched anisotropically to form a cavity that leaves a thin diaphragm underlying the bridge of the four piezoresistors.

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A. Bohg, "Ethylene Diamene-Pyrocathechol-Water Mixture Shows Etching Anomaly in Boron-Disposed Silicon," J. Electrochem. Soc.: Electrochemical Technology, v 18, n 2, pp. 401-402 (Feb. 1971).
J. C. Greenwood, "Ethylene Diamene-Cathechol-Water Mixture Shows Preferential Etching of p-n Junction," J. Electrochem. Soc.: Electrochemical Technology, v 116, n 9, pp. 1325-1326 (Sep. 1969).
J. A. Oakes, "A Pressure Sensor for Automotive Application," Proceedings of the Third International Conference on Automotive Electronics, pp. 143-9, Oct. 20-23, 1981, London, England, sponsored by the Institute for Mechanical Engineers.

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