Monolithic molded flexible electronic assemblies without...

Details Monolithic molded flexible electronic assemblies without... Monolithic molded flexible electronic assemblies without...

2011-05-17

2011-05-17

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257S687000

Reexamination Certificate

active

07943434

ABSTRACT:
A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

REFERENCES:
patent: 6193493 (2001-02-01), Steijer et al.
patent: 6291882 (2001-09-01), Lin

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