Fishing – trapping – and vermin destroying
Patent
1996-05-09
1997-07-29
Chaudhari, Chandra
Fishing, trapping, and vermin destroying
437 21, 437 51, H01L 21786
Patent
active
056521731
ABSTRACT:
A monolithic microwave integrated circuit (MMIC) is produced by a method which forms multilevel conductive members, including thick low-loss metallic members. The low-loss metallic members are particularly useful for forming inductors and interconnecting circuit components. The MMIC is formed on a thick oxide layer of a silicon-on-insulator structure having a high-resistivity silicon substrate to inhibit RF interaction with the substrate.
REFERENCES:
patent: 4418470 (1983-12-01), Naster et al.
patent: 4767724 (1988-08-01), Kim et al.
patent: 4789648 (1988-12-01), Chow et al.
patent: 5162258 (1992-11-01), Lemnios et al.
patent: 5219787 (1993-06-01), Carey et al.
patent: 5376574 (1994-12-01), Peterson
"Electrochemical Effects on Chemical Mechanical Polishing and Corrosion Rate of Copper Films", by J.M. Steigerwald et al, Center for Integrated Electronics, RPI, Troy, New York. (No date).
"Reverse Pillar and Maskless Contact -Two Novel Recessed Metal Schemes and Their Comparisons to Conventional VLSI Metallization Schemes", by J.L. Yeh et al, AT&T Bell Laboratories, Allentown, Pennsylvania, pp. 95-100., 1988.
"A 2.45 GHz Power LD-MOSFET With Reduced Source Inductance by V-Groove Connections", by O. Ishikawa et al, Semiconductor Research Center Matsushita Electric Industrial Co., Ltd. Osaka, Japan, IEDM 1985, pp. 166-169.
"Field Theory Analysis of Slow-Wave Propagation on Silicon Based Coplanar MIS Transmission Lines", by S. Chen et al, Laboratory of Lightwave Electronics, Microwaves and Communications, pp. 1, 4-10., 1993.
"Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing" by S.P. Murarka et al, MRS Bulletin, Jun. 1993, pp. 46-51.
"Electrochemical Effects in the Chemical-Mechanical Polishing of Copper and Titanium Thin Films Used for Multilevel Interconnect Schemes", by J.S. Steigerwald et al, Center for Integrated Electronics, RPI, Troy, New York. (No date).
Chaudhari Chandra
Kraus Robert J.
Philips Electronics North America Corporation
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