Monolithic microelectronic circuit package including low-tempera

Details Monolithic microelectronic circuit package including low-tempera Monolithic microelectronic circuit package including low-tempera

1993-07-29

1995-01-31

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 257700, 257720, 361749, 361795, H05K 720

Patent

active

053863399

ABSTRACT:
A dielectric structure (12) includes a plurality of stacked sheets (16) of low thermal conductivity, low-temperature-cofired-ceramic (LTCC) tape formed with a hole (18) therethrough. A heat sink (20) includes a plurality of stacked sheets (22) of high thermal conductivity LTCC tape disposed in the hole (18). The high thermal conductivity sheets (22) and the low thermal conductivity sheets (16) are cofired to produce the heat sink (20) as an in-situ element in the dielectric structure (12). A heat generating electrical component (28) is mounted on the heat sink (20) in thermal communication therewith. The dielectric structure (12) is mounted on a high thermal conductivity substrate (24) with the heat sink (20) in thermal communication with the substrate (24) to conduct away heat generated by the component (28). The high thermal conductivity sheets (22) and the substrate (24) can be electrically conductive and electrically communicate with the component (28), or can be electrically insulative.

REFERENCES:
patent: 4860165 (1989-08-01), Cassinelli
patent: 4899118 (1990-02-01), Polinski, Sr.
patent: 4967201 (1990-10-01), Rich, III
patent: 5012386 (1991-04-01), McShane
patent: 5045921 (1991-09-01), Lin
patent: 5130768 (1992-07-01), Wu
patent: 5285352 (1994-02-01), Pastore
Development of a Low Temperature Cofired Multilayer Ceramic Technology, by W. Vitriol et al., ISHM Proceedings 1983, pp. 593-598.

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