Monolithic integrated circuit interconnection and fabrication me

Details Monolithic integrated circuit interconnection and fabrication me Monolithic integrated circuit interconnection and fabrication me

1980-11-25

1983-02-15

Edlow, Martin H.

357 4, 357 41, 357 58, 357 68, 357 65, 357 15, H01L 2978

Patent

active

043743927

ABSTRACT:
A monolithic integrated circuit incorporates a substrate of III-V material having an interconnection pattern disposed on a surface thereof. An epitaxial layer is grown on the substrate surface such that it overgrows the interconnection pattern, and a plurality of circuit elements, formed on the surface of the epitaxial layer, are interconnected by contacts which extend from the epitaxial layer surface to the underlying interconnection pattern.

REFERENCES:
patent: 3593068 (1971-02-01), Rosler
patent: 3641661 (1972-02-01), Canning
patent: 4141021 (1979-02-01), Decker
patent: 4226649 (1980-10-01), Darey
Bolzer et al., IEEE Trans. on Electron Devices, vol. ED-27, No. 6, Jun. 1980.

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