Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1997-08-04
2000-02-08
Barlow, John
Etching a substrate: processes
Forming or treating thermal ink jet article
347 65, G01D 1500, B11B 0527
Patent
active
060224827
ABSTRACT:
A method and structure are described for a monolithic roofshooter ink jet printhead which has nozzles and ink channels formed in a polyimide layer overlying a silicon substrate. Resistor heaters, addressing logic circuitry, and ink inlets are formed in a silicon substrate. A fabrication process, simple and monolithic, is performed at low temperatures resulting in a structure which has nozzle diameters of 30 .mu. separated by distances of 10 .mu. or less. This structure results in a printhead which has a printing resolution of 630 dpi.
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P.F. Man, D. K. Jones, and C. H. Mastrangelo, "Microfluidic Plastic Capillaries on Silicon Substrates: A New Inexpensive Technology for Bioanalysis Chips", Center for Integrated Sensors and Circuits, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109-2212, USA, published on Jan. 26, 1997, in the Proceedings of IEEE 10th Annual International Workshop on Micro Elecro Mechanical Systems, on pp. 311-316.
Chen Jingkuang
Hseih Biay-Cheng
Barlow John
Mahoney H.
Xerox Corporation
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