Monolithic electronic modules--fabrication and structures

Details Monolithic electronic modules--fabrication and structures Monolithic electronic modules--fabrication and structures

1995-04-27

1997-03-25

Ahmad, Nasser

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

29829, 29840, 269903, 269909, 428 409, 428 419, 428212, 428699, 428914, H05K 334

Patent

active

056142773

ABSTRACT:
This invention comprises various high production methods for simultaneously forming surface metallizations on a plurality of monolithic electronic modules. Each monolithic electronic module may comprise a single semiconductor chip or multiple semiconductor chips. The methods can employ a workpiece which automatically discontinues side surface metallization between different electronic modules in the stack. Multiple workpieces are interleaved within the stack between the electronic modules. Each workpiece may include a transfer layer(s) for permanent bonding to an end surface of an adjacent electronic module in the stack. This transfer layer may comprise an insulation layer, a metallization layer, an active circuit layer, or any combination thereof. End surface metallization can thus be provided contemporaneous with side surface metallization of multiple electronic modules.

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