Monolithic common carrier

Details Monolithic common carrier Monolithic common carrier

2007-01-16

2007-01-16

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S021000, C438S401000, C438S125000, C438S455000

Reexamination Certificate

active

10692884

ABSTRACT:
A common carrier for forming multiple printheads thereon and method of forming thereof is described. The common carrier includes a carrier substrate for adhering a plurality of unprocessed, integrateable semiconductor chips. Once adhered, the carrier substrate is lithographically processed to form a plurality of integrated circuit (IC) printhead chips such that alignment of the IC chips on the carrier substrate has the precision of lithographic alignment tolerances which is well within printhead alignment requirements.

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