Monolithic combined charge transfer and surface acoustic wave de

Wave transmission lines and networks – Coupling networks – Delay lines including elastic surface wave propagation means

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332 2, 332 52, 333195, 333196, 357 26, 364821, H03H 964, H03H 930, H03H 1502

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044686390

ABSTRACT:
A novel technique for fabrication of a new class of surface acoustic wave (SAW) signal processing devices. Substrates of non-piezoelectric silicon or weakly piezoelectric gallium arsenide are prepared and a thin film of a piezoelectric material, such as zinc oxide, is deposited on the substrate. Interdigital transducers are fabricated at each end of the device to inject/receive SAW signals. A row of P-N diodes is constructed in the substrate underneath the SAW beam path and a metal electrode is deposited on top of the zinc oxide film. The diodes may be serially addressed/controlled by a variety of devices external to the SAW beam path, but fabricated on the same substrate and the new device used to provide transformation between high-frequency signals and low-frequency signals having the same time-bandwidth product.

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