Monitoring signals between two integrated circuit devices...

Details Monitoring signals between two integrated circuit devices... Monitoring signals between two integrated circuit devices...

2006-11-07

2006-11-07

Nghiem, Michael (Department: 2863)

Data processing: measuring, calibrating, or testing

Testing system

Of circuit

Reexamination Certificate

active

07133798

ABSTRACT:
In one embodiment, a method is provided for monitoring signals communicated between a first integrated circuit chip and a second integrated circuit chip within a single packaged semiconductor device, wherein at least some external terminals for the packaged semiconductor device are shared by the first and second integrated circuit chips. The method includes the following: receiving signals from the first integrated circuit chip at a plurality of bond pads on the second integrated circuit chip; selecting a portion of the received signals; and outputting the selected portion of the received signals from the single packaged semiconductor device.

REFERENCES:
patent: 6351681 (2002-02-01), Chih et al.
patent: 2004/0150089 (2004-08-01), Inoue et al.

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