Monitoring apparatus for polishing pad and method thereof

Details Monitoring apparatus for polishing pad and method thereof Monitoring apparatus for polishing pad and method thereof

2006-02-07

2006-02-07

Toatley, Jr., Gregory J. (Department: 2877)

Optics: measuring and testing

Dimension

Thickness

C356S622000

Reexamination Certificate

active

06995850

ABSTRACT:
A monitoring apparatus for a polishing pad. A chemical mechanical polishing machine, a polishing pad, a measuring device, and a display device are provided. The polishing pad is situated in a predetermined position in the chemical mechanical polishing machine. The measuring device is coupled to the chemical mechanical polishing machine to measure the thickness of the polishing pad. The measured thickness of the polishing pad is displayed on the display device.

REFERENCES:
patent: 6075606 (2000-06-01), Doan
patent: 384394 (2000-03-01), None
patent: 466153 (2001-12-01), None

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