Monitor method for testing probe pins

Details Monitor method for testing probe pins Monitor method for testing probe pins

1999-11-30

2001-08-28

Metjahic, Safet (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB, C439S482000

Reexamination Certificate

active

06281694

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates to a testing method. More particularly, the present invention relates to a monitor method for testing probe pins used in a WAT (wafer acceptance test) process.
2. Description of Related Art
After completing manufacturing processes, dies on the wafer should be verified. Generally, a probe card with probe pins is used to test the dies. The probe pins on the probe card directly contact the wafer to perform the testing process. Since the probe pins directly contact the wafer, the probe pins are easily deformed. Moreover, some materials such as oxide, photoresist residues or solvent contamination are usually adhered on the probe pins due to the direct contact. Therefore, erroneous data may be obtained by using the problem probe pins.
FIG. 1
is a schematic diagram showing probe pins with various problems including a short, unstable contact and deformity.
Referring to
FIG. 1
, probe pins
12
a
,
12
b
,
12
c
,
12
d
,
12
e
are formed on a probe card
10
. The probe pin
12
a
is normal. Material
14
a
is adhered on the probe pin
12
b
, and material
14
b
is adhered on the probe pins
12
c
,
12
d
. The materials
14
a
,
14
b
are, for example, oxide, photoresist residues or solvent contamination. Because of the material
14
b
, the probe pin
12
c
and
12
d
are shorted. The probe pin
12
e
is deformed; thus, the probe pin
12
e
cannot contact the wafer during the testing process.
Since the dimension of the probe pin is small, it is difficult to identify the above problems. Moreover, many probe pins are formed on a probe card; thus, it is difficult to identify a particular probe pin. Consequently, erroneous results are obtained during the testing process by using the problem probe pins.
SUMMARY OF THE INVENTION
The invention provides a monitor method for testing probe pins, which method is applied on a testing apparatus with a plurality of probe pins. In accordance with the method disclosed in the present invention, a particular probe pin suffering a short, deformity or unstable contact is identified.
The invention provides a monitor method for testing probe pins. By the method, a plurality of the probe pins are grouped and tested to identify the problem probe pin.
The invention provides a monitor method for testing probe pins to identify a probe pin suffering from a short.
The invention provides a monitor method for testing probe pins to identify a deformity or unstable contact of the probe pin.
As embodied and broadly described herein, the invention provides a monitor method for testing probe pins. The method includes the following steps. A plurality of probe pins is grouped, and a group includes several probe pins. The probe pins are floated. Then, a probe pin in a group is charged to measure the resistance thereof, and other probe pins in the same group are grounded. By checking the resistance of each probe pin, the short is identified. Next, a sample wafer with a thin film thereon is prepared, and the probe pins directly contact the sample wafer. The probe pins are charged to measure the contact resistance of each probe pin. In accordance with the contact resistance of each probe pin, the deformity or unstable contact is identified.
The invention also provides a monitor method for testing probe pins to identify a short. The method includes the following steps. A plurality of probe pins is grouped, and a group includes several probe pins. The probe pins are floated, and then charged to measure the resistance of each probe pin.
The invention furthermore provides a monitor method for testing probe pins to identify a deformity or unstable contact. The method includes the following steps. A plurality of probe pins is grouped, and a group includes several probe pins. A sample wafer with a thin film thereon is prepared. The probe pins contact the sample wafer, and then the probe pins are charged to measure the contact resistance of each probe pin.
In the present invention, a monitor method for testing probe pins is provided. With the present invention, a plurality of probe pins is grouped and tested simultaneously. Then, the particular problem probe pin suffering a short, deformity or unstable contact is identified.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.


REFERENCES:
patent: 3783375 (1974-01-01), Bennett
patent: 4379401 (1983-04-01), San Miguel
patent: 4864227 (1989-09-01), Sato
patent: 5585736 (1996-12-01), Hshieh et al.
patent: 5691467 (1997-11-01), Goldmann et al.
patent: 5818249 (1998-10-01), Momohara
patent: 5844421 (1998-12-01), Lee at al.
patent: 5902504 (1999-05-01), Merchant et al.
patent: 5933309 (1999-08-01), Smith

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