Monitor-detector assembly on silicon wafer board

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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372 36, 385 25, G01R 3128, H01S 304, G02B 636

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active

056940483

ABSTRACT:
An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.

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IEEE Transactions On Components, Hybrids And Manufacturing Technology; "Gigabit Transmitter Array Modules On Silicon Waferboard"; Craig A. Armiento; vol. 15; No. 6; Dec. 1992.
"1995 Proceedings 45th Electronic Components & Technology Conference-May 21-May 24, 1995"; pp. 841-845.
Electronic Letters "Self-Aligned Flat-Pack Fibre-Photodiode Coupling"; Jul. 1988; vol. 24; No. 15.
PCT International Search Report. International Application No. PCT/US96/02334; International Filing Date Feb. 14, 1996.

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