Molybdenum substrate thick film circuit

Details Molybdenum substrate thick film circuit Molybdenum substrate thick film circuit

1979-12-17

1982-02-02

Crosby, Gene P.

Metal working

Method of mechanical manufacture

Electrical device making

29831, 29846, 156 89, H05K 334

Patent

active

043132626

ABSTRACT:
An improved multilayered circuit is disclosed comprising a molybdenum substrate with alternating layers of dielectric and conducting thick film materials deposited thereon. The molybdenum substrate has the advantages of being its own chassis, having a coefficient of thermal expansion that is well matched to the thick film materials and component ceramic chip carriers, and having a high thermal conductivity so as to act as its own heat sink.

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J. Gniewek et al., IBM Tech. Discl. Bul., vol. 18, No. 9, Feb. 1976, pp. 2856-2857.

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