Etching a substrate: processes – Forming or treating mask used for its nonetching function
Reexamination Certificate
2006-10-03
2006-10-03
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Forming or treating mask used for its nonetching function
C430S005000
Reexamination Certificate
active
07115207
ABSTRACT:
Disclosed is a method of manufacturing a metal mask for an integrated circuit chip interconnect solder bump. The invention deposits a very thick photoresist on both sides of a very thick molybdenum foil sheet (the molybdenum sheet is at least 8 mils thick and the photoresist is at least 5 microns thick). Then the process exposes and develops the photoresist to produce at least one opening having a diameter of at least 5 mil. The invention simultaneously etches both sides of the molybdenum foil using a very low etchant spray pressure of approximately 5 psi to form at least one via in the molybdenum foil that has a diameter of at least 12 mil and a knife-edge of 0.2 mil. The photoresist is removed after the etching process.
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patent: 2004/0238491 (2004-12-01), Berasi et al.
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Berasi Peter H.
Jerome Michael F.
Pulaski Doris P.
Rippstein Robert P.
Cioffi, Esq. James J.
Culbert Roberts
Gibb I.P. Law Firm LLC
Hassanzadeh Parviz
International Businss Machines Corporation
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