Molecular beam source for use in accumulation of organic...

Electric resistance heating devices – Heating devices – Vaporizer

Reexamination Certificate

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C118S726000

Reexamination Certificate

active

11183720

ABSTRACT:
A molecular beam source for use in accumulation of organic thin-films which enables the forming of a uniform thin-film on film-forming surfaces of a large-sized substrate, but without producing deposition or separation of a film-forming material in an opening for discharging molecules of the film-forming material, wherein a valve33is disposed in a space starting from a side of a molecule heating portion12and reaching to a molecule discharge opening14for discharging the generated molecules of the film-forming material towards a film-forming surface and, further, heaters18and19are provided at a side of the molecule discharge opening14for heating the molecules of the film-forming material to be discharged. At the side of the molecule discharge opening14are provided an exterior guide13having a tapered guide wall and also an interior guide16having a tapered guide wall is provided within an inside of the exterior guide. Between the exterior guide13and interior guide16, there is formed a molecule discharge passage17in which the diameter thereof gradually increases along a direction of the discharge of the molecules therefrom. The heaters18and19are provided on the exterior guide13and the interior guide16, respectively and, further, there is provided a heater20penetrating through the molecule discharge opening14, whereby narrowing and/or blockage hardly occur in the discharge opening.

REFERENCES:
patent: 4565158 (1986-01-01), Koprio
patent: 5253266 (1993-10-01), Knodle et al.
patent: 5336324 (1994-08-01), Stall et al.
patent: 5820681 (1998-10-01), Colombo et al.
patent: 2002/0197418 (2002-12-01), Mizukami et al.
patent: 2003/0175422 (2003-09-01), Cord
patent: 2003 002778 (2003-01-01), None
patent: 2003 095787 (2003-04-01), None
Webster's II New Riverside University Dictionary, Houghton Mifflin Co., 1984. pp. 859 and 869.

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