Molecular beam epitaxy using premixing

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148 15, 156610, 156DIG70, H01L 21203

Patent

active

041599195

ABSTRACT:
An improved method of forming ternary and quaternary epitaxial films by molecular beam epitaxy involves controlling precisely the ratio of concentrations of two alloying elements in the final compound by heating predetermined independently adjustable quantities of two or more alloying elements in the same oven.

REFERENCES:
patent: 3672992 (1972-06-01), Schaefer
patent: 3716424 (1973-02-01), Schoolar
patent: 3793070 (1974-02-01), Schoolar
patent: 3915765 (1975-10-01), Cho et al.
patent: 4069356 (1978-01-01), Fischer
Chang et al., "Fabrication for Multilayer Semiconductor Devices", I.B.M. Tech. Discl. Bull., vol. 15, No. 2, Jul. 1972, pp. 365-366.
Chang et al., "Source Shaping . . . by Molecular Beam Epitaxy".
Ibid., vol. 15, No. 1, Jun. 1972, pp. 180-181.
Cho et al., "Molecular Beam Epitaxy of GaAs, AlGaAs and GaP", 1970 Symposium on GaAs, Paper No. 2, pp. 18-29.
Bis et al., "Thin Epitaxial Films of Pb.sub.1-x Sn.sub.x Te", J. Vac. Science & Technology, vol. 9, No. 1, pp. 226-230.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Molecular beam epitaxy using premixing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molecular beam epitaxy using premixing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molecular beam epitaxy using premixing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2274058

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.