Molds for wafer scale molding of protective caps

Details Molds for wafer scale molding of protective caps Molds for wafer scale molding of protective caps

2006-01-31

2006-01-31

Heckenberg, Donald (Department: 1722)

Static molds

Container-type molding device

Of named component

C249S162000, C425S408000

Reexamination Certificate

active

06991207

ABSTRACT:
Two molds (102, 104) are provided formed of semiconductor material. The molds (102, 104) have substantially planar working faces (108, 110) into which recesses (106, 112) are formed. In use the molds (102, 104) are pressed together with the working faces (108, 110) opposed so the recesses (106, 112) form mold cavities. The molds (102, 104) only contact each other in the plane of the working faces (108, 110)

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