Molds and method of using the same for forming plus or minus...

Details Molds and method of using the same for forming plus or minus... Molds and method of using the same for forming plus or minus...

2007-05-22

2007-05-22

Gupta, Yogendra N. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Lens mold

C425S174400, C249S115000, C249S134000, C264S002500, C264S002700

Reexamination Certificate

active

11188223

ABSTRACT:
The present invention encompasses, in part, a method and apparatus for lens casting in which two molds, preferably formed of plastic, are interconnected or joined together via a ring to form a mold cavity having substantially the same dimensions of the lens to be formed therein. The invention is further directed to compositions and methods used in lens casting. In a first implementation the invention includes a mold having a ring having an interior periphery; a front mold formed of a plastic and having a lens-forming surface, an edge circumscribing the lens-forming surface that is sized to be complementarily received within a portion of the interior periphery of the ring, and a base having dimensions greater than the interior periphery; and a rear mold formed of a plastic and having a lens-forming surface.

REFERENCES:
patent: 3946982 (1976-03-01), Calkins et al.
patent: 4159292 (1979-06-01), Neefe
patent: 4284399 (1981-08-01), Newcomb et al.
patent: 4338269 (1982-07-01), Russell
patent: 4544572 (1985-10-01), Sandvig et al.
patent: 4640489 (1987-02-01), Larsen
patent: 4758448 (1988-07-01), Sandvig et al.
patent: 4873029 (1989-10-01), Blum
patent: 4919850 (1990-04-01), Blum et al.
patent: 4955580 (1990-09-01), Seden et al.
patent: 5036971 (1991-08-01), Seden et al.
patent: 5049321 (1991-09-01), Galic
patent: 5143660 (1992-09-01), Hamilton et al.
patent: 5160668 (1992-11-01), Imus
patent: 5254000 (1993-10-01), Friske et al.
patent: 5260001 (1993-11-01), Nandu et al.
patent: 5524419 (1996-06-01), Shannon
patent: 5551663 (1996-09-01), Bae et al.
patent: 5681510 (1997-10-01), Valint, Jr. et al.
patent: 5733483 (1998-03-01), Soane et al.
patent: 5804107 (1998-09-01), Martin et al.
patent: 5837314 (1998-11-01), Beaton et al.
patent: 5922249 (1999-07-01), Ajello et al.
patent: 5981618 (1999-11-01), Martin et al.
patent: 6068464 (2000-05-01), Su et al.
patent: 6099764 (2000-08-01), Su et al.
patent: 6103148 (2000-08-01), Su et al.
patent: 6113817 (2000-09-01), Herbrechtsmeier et al.
patent: 6241505 (2001-06-01), Buazza et al.
patent: 6478990 (2002-11-01), Powers et al.
patent: 6565776 (2003-05-01), Li et al.
patent: 6772988 (2004-08-01), Altmann
patent: 6776934 (2004-08-01), Lai
patent: 6869549 (2005-03-01), Ansell et al.
patent: 6872335 (2005-03-01), Su et al.
patent: 6887402 (2005-05-01), Klemm et al.
patent: 6890458 (2005-05-01), Weber et al.
patent: 6986857 (2006-01-01), Klemm et al.
patent: 7114696 (2006-10-01), Su et al.
patent: 2002/0163095 (2002-11-01), Andino et al.
patent: 2003/0057578 (2003-03-01), Haidl et al.
patent: 2003/0094714 (2003-05-01), Buazza et al.
patent: 2003/0146527 (2003-08-01), Powers et al.
patent: 2003/0164562 (2003-09-01), Li et al.
patent: 2004/0041287 (2004-03-01), Engardio et al.
patent: 2004/0099971 (2004-05-01), Su et al.
patent: 2004/0119174 (2004-06-01), Hofmann et al.
patent: 2005/0068492 (2005-03-01), Itoh et al.
patent: 1 226 011 (2004-02-01), None
patent: PCT/AU00/01152 (2000-09-01), None
patent: WO 03-068416 (2003-08-01), None
U.S. Appl. No. 10/075,637, filed Feb. 2002, Su et al.
U.S. Appl. No. 10/045,130, filed Mar. 2002, Su et al.
U.S. Appl. No. 10/992,224, filed Nov. 2004, Su et al.
U.S. Appl. No. 11/215,361, filed Aug. 2005, Su et al.
U.S. Appl. No. 10/095,130.
U.S. Appl. No. 10/188,223.
International Search Report and Opinion, International Application No. PCT/US05/41915, Jun. 6, 2006.
International Search Report and Opinion, International Application No. PCT/US05/41619, Mar. 17, 2006.

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