Molding technique for molding plastic packages

Details Molding technique for molding plastic packages Molding technique for molding plastic packages

1995-12-12

1997-09-09

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, 425116, B29C 4514

Patent

active

056652968

ABSTRACT:
A method for assembling a plastic integrated circuit package. The method includes placing an integrated circuit die and lead frame into a mold. The mold has a first gate that is in fluid communication with a first side of the lead frame and a second opposite gate which is in fluid communication with a second side of the lead frame. The lead frame also has a mold flow hole adjacent to the gates. A plastic encapsulant is injected into both gates and flows across each side of the lead frame. The mold flow opening allows encapsulant to flow between each side of the lead frame.

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