Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2006-11-28
2006-11-28
Nguyen, Nam (Department: 1753)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S097700, C204S192100
Reexamination Certificate
active
07141269
ABSTRACT:
A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is patterned according to the copper interconnecting wires and displaced to form the copper interconnecting wires in a specific chemical solution.
REFERENCES:
patent: 5308796 (1994-05-01), Feldman et al.
patent: 6261637 (2001-07-01), Oberle
Chen Giin-Shan
Hsu Hong-Yuan
Liu Don-Gey
Yang Chin-Hao
Yang Tsong-Jen
Feng Chia University
Nguyen Nam
Van Luan V.
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