Molding system with integrated film heaters and sensors

Details Molding system with integrated film heaters and sensors Molding system with integrated film heaters and sensors

2006-07-04

2006-07-04

Pelham, Joseph (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S422000, C219S511000, C425S549000, C425S392000, C425S470000

Reexamination Certificate

active

07071449

ABSTRACT:
Film heater apparatus and method for heating a melt channel in a molding device includes structure and/or steps whereby a first dielectric layer is disposed on a surface of a substrate. An active heating element is disposed on the first dielectric layer, the active heating element being configured to generate heat to heat the melt channel. The active heating element has contact terminals arranged to support an electrical connection to the active heating element. A second dielectric layer is disposed over the active heating element, but not covering the contact terminals, thereby permitting coupling of the heater element to an electrical supply.

REFERENCES:
patent: 2979773 (1961-04-01), Bolstad
patent: 3067310 (1962-12-01), Walz et al.
patent: 3399428 (1968-09-01), Valyl
patent: 3970821 (1976-07-01), Crandell
patent: 4120086 (1978-10-01), Crandell
patent: 4132971 (1979-01-01), Caddock, Jr.
patent: 4203197 (1980-05-01), Crandell
patent: 4273525 (1981-06-01), Reitan
patent: 4304544 (1981-12-01), Crandell
patent: 4310401 (1982-01-01), Stahl
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4390485 (1983-06-01), Yang
patent: 4396899 (1983-08-01), Ohno
patent: 4455744 (1984-06-01), Zandman
patent: 4485387 (1984-11-01), Drumheller
patent: 4510036 (1985-04-01), Takeuchi et al.
patent: 4514160 (1985-04-01), Davidsmeyer
patent: 4557685 (1985-12-01), Gellert
patent: 4570150 (1986-02-01), Zandman et al.
patent: 4583284 (1986-04-01), Gellert
patent: 4641423 (1987-02-01), Crandell
patent: 4648833 (1987-03-01), Yamada
patent: 4659906 (1987-04-01), Furtek
patent: 4739657 (1988-04-01), Higashi et al.
patent: 4748982 (1988-06-01), Horzewski et al.
patent: 4768283 (1988-09-01), Gellert
patent: 4782708 (1988-11-01), Harrington et al.
patent: 4795126 (1989-01-01), Crandell
patent: 4808490 (1989-02-01), Tsukuda et al.
patent: 4859981 (1989-08-01), Peschl
patent: 4882203 (1989-11-01), Witmer
patent: 4897028 (1990-01-01), Barancik et al.
patent: 4899126 (1990-02-01), Yamada
patent: 4899435 (1990-02-01), Trakas
patent: 4911636 (1990-03-01), Gellert
patent: 4922082 (1990-05-01), Bredt et al.
patent: 4964795 (1990-10-01), Tooman
patent: 5007818 (1991-04-01), Barancik et al.
patent: 5046942 (1991-09-01), Gellert
patent: 5051086 (1991-09-01), Gellert
patent: 5085572 (1992-02-01), Leverenz
patent: 5112025 (1992-05-01), Nakayama et al.
patent: 5155340 (1992-10-01), Morita et al.
patent: 5215597 (1993-06-01), Kreider
patent: 5226596 (1993-07-01), Okamura
patent: 5234637 (1993-08-01), Reymann et al.
patent: 5320513 (1994-06-01), Schmidt
patent: 5411392 (1995-05-01), Von Buren
patent: 5421715 (1995-06-01), Hofstetter et al.
patent: 5434388 (1995-07-01), Kralik et al.
patent: 5456592 (1995-10-01), Shindo
patent: 5468141 (1995-11-01), Iwami et al.
patent: 5470219 (1995-11-01), Yokoyama et al.
patent: 5504304 (1996-04-01), Noguchi et al.
patent: 5504307 (1996-04-01), Hayashi et al.
patent: 5518389 (1996-05-01), Nonomura et al.
patent: 5521357 (1996-05-01), Lock et al.
patent: 5521576 (1996-05-01), Collins
patent: 5527177 (1996-06-01), Potter
patent: 5536164 (1996-07-01), Brun, Jr. et al.
patent: 5548268 (1996-08-01), Collins
patent: 5557704 (1996-09-01), Dennis et al.
patent: 5561296 (1996-10-01), Goto
patent: 5569398 (1996-10-01), Sun et al.
patent: 5569474 (1996-10-01), Kitaichi et al.
patent: 5573692 (1996-11-01), Das et al.
patent: 5632078 (1997-05-01), Potter
patent: 5641421 (1997-06-01), Manov et al.
patent: 5653932 (1997-08-01), Aida et al.
patent: 5705793 (1998-01-01), Kitaichi et al.
patent: 5822675 (1998-10-01), Paquet et al.
patent: 5871786 (1999-02-01), Hume et al.
patent: 5895591 (1999-04-01), Kojima et al.
patent: 5916467 (1999-06-01), Shimada
patent: 5973296 (1999-10-01), Juliano et al.
patent: 6222166 (2001-04-01), Lin et al.
patent: 6305923 (2001-10-01), Godwin et al.
patent: 6341954 (2002-01-01), Godwin et al.
patent: 6575729 (2003-06-01), Godwin et al.
patent: 6764297 (2004-07-01), Godwin et al.
patent: 3431 173 (1984-08-01), None
patent: 0 238 355 (1987-09-01), None
patent: 0 282 805 (1987-09-01), None
patent: 0312029 (1994-05-01), None
patent: 55067417 (1980-05-01), None
patent: 55-161626 (1980-12-01), None
patent: 5-116182 (1993-05-01), None
Peter M.B. Walker, Chambers Science and Technology Directory, 1988.
M. Noriaki, Patent Abstracts of Japan, with respect to JP 63-176119 of Jul. 7, 1988.
Engineering & Processing News (XP-002115780), Modern Plastics International, No. 9, Sep. 1985, p. 28.
H. Shoji, et al., Patent Abstracts of Japan, with respect to JP 55-161626 of Dec. 16, 1980.

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