Molding-system clamp assembly

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S595000, C425S451900

Reexamination Certificate

active

07404920

ABSTRACT:
A molding-system clamp assembly of a molding system is disclosed, and includes a clamp piston, and a clamp ram, the clamp ram and the clamp piston each including inter-meshable structures to selectively inter-mesh the clamp piston to the clamp ram, in the unmeshed position the clamp piston and the clamp ram do not inter-mesh relative to each other, and inter-abuttable structures to selectively inter-abut the clamp piston relative to the clams ram, the inter-abuttable structures having an interposing body abuttable against the clamp ram and the clamp piston, the inter-abuttable structures to abut with each other so that the clams piston makes contact with the interposing body, and the inter-abuttable structures to transfer a mold-break force so that the mold-break force is applied from the clamp piston against the interposing body, and in response the mold-break force is transferred from the clamp piston through the interposing body and to the clamp ram, and once mold break has occurred, the clamp piston is deactivated so that the mold may be opened.

REFERENCES:
patent: 3587138 (1971-06-01), Bammert et al.
patent: 3656877 (1972-04-01), Aoki
patent: 5368463 (1994-11-01), Kassner et al.
patent: 5753153 (1998-05-01), Choi
patent: 5853773 (1998-12-01), Choi
patent: 5922372 (1999-07-01), Schad
patent: 6200123 (2001-03-01), Mailliet et al.
patent: 6250905 (2001-06-01), Mailliet et al.
patent: RE37827 (2002-09-01), Schad
patent: 6468449 (2002-10-01), Fujikawa
patent: 2005/0287246 (2005-12-01), Looije
patent: WO 93/16828 (1993-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Molding-system clamp assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding-system clamp assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding-system clamp assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2781919

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.