Molding resin composition and molded electronic component

Details Molding resin composition and molded electronic component Molding resin composition and molded electronic component

1991-11-25

1993-10-12

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523456, 524275, 524277, 524279, 524322, 524487, C08K 509

Patent

active

052526399

ABSTRACT:
The molding resin composition of this invention comprises a resin contained a releasing a agents formulated with a release agent and a metal chelate compound.
This resin composition is improved an good adhesivity, high moisture resistivity and a good moldability.

REFERENCES:
patent: 3624032 (1971-11-01), Miyashiro et al.
patent: 3812214 (1974-04-01), Markovitz
patent: 4552907 (1985-11-01), Sato et al.
patent: 4719255 (1988-01-01), Yoshizumi et al.

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