Molding process utilizing a molding apparatus

Details Molding process utilizing a molding apparatus Molding process utilizing a molding apparatus

1997-09-16

1999-11-30

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Direct application of electrical or wave energy to heat the...

264 401, 264 406, 264 452, 264 466, 264 468, 264458, 264515, 264521, 264540, 264904, B29C 4904, B29C 4964, B29C 4978

Patent

active

059937211

ABSTRACT:
A process and an apparatus for molding, in which a molten thermoplastic resin is firmly fitted onto a molding surface of a mold under a pressure lower than or equal to 100 kg/cm.sup.2 and is cured to obtain a molded product. The molding apparatus has a mold main body, and a mold body on which the molding surface is defined. The mold body is supported relative to the mold main body with maintaining a space on the back side of the molding surface in a heat insulative manner by a supporting member which includes at least a heat insulative supporting member having a thermal conductivity of 0.001 to 1 Kcal/mh.degree. C. and a longitudinal elastic modulus of 0.01 to 10 kg/cm.sup.2. In the space, a heating fluid for heating the molding surface from the back side to a temperature higher than or equal to Vicat softening temperature (T).degree. C. of the thermoplastic resin and a cooling fluid for cooling the molding surface from the back side to a temperature lower than or equal to (Vicat softening temperature (T) of the thermoplastic resin-10).degree. C. are supplied.

REFERENCES:
patent: 3097398 (1963-07-01), Inglesby
patent: 3733161 (1973-05-01), Nussbaum
patent: 3768948 (1973-10-01), Horberg, Jr. et al.
patent: 3784344 (1974-01-01), Korsch
patent: 3937609 (1976-02-01), Ryder
patent: 4087227 (1978-05-01), Uhlig
patent: 4482306 (1984-11-01), Hahn
patent: 4938676 (1990-07-01), Jackowski et al.
patent: 5017126 (1991-05-01), Yamada et al.
patent: 5190715 (1993-03-01), Yamada et al.
patent: 5207969 (1993-05-01), Shirahata
patent: 5234637 (1993-08-01), Reymann et al.
patent: 5368458 (1994-11-01), Addeo et al.
patent: 5423670 (1995-06-01), Hamel
patent: 5472331 (1995-12-01), Watkins
patent: 5840223 (1998-11-01), Feuerherm et al.
A. Delaney et al., "Plastic Molding Apparatus", IBM Technical Disclosure Bulletin, vol. 17, No. 2, p. 479-480., Jul. 1974.

Affiliated with

Also associated with

Rating

Molding process utilizing a molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding process utilizing a molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding process utilizing a molding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1667556