Molding process using curable silicone release compositions

Details Molding process using curable silicone release compositions Molding process using curable silicone release compositions

1979-03-05

1981-01-13

Thurlow, Jeffery R.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

264 464, 264 467, 264 51, 528 15, 528 31, 528 32, C08G 7712, C08G 7720

Patent

active

042449120

ABSTRACT:
An improved molding process is provided which comprises treating a mold surface with certain curable silicone compositions to improve the release of a molded article from the mold. The curable silicone release composition is obtained by mixing a vinyl-endblocked polydiorganosiloxane, a xylene-soluble vinyl-containing resinous polysiloxane, a methylhydrogenpolysiloxane crosslinking agent and a hydrosilylation catalyst. The curable silicone release composition is easily applied to and rapidly cured onto the mold surface and, when cured, provides many easy releases of molded articles such as high resiliency polyurethane foam cushions, polyurethane elastomeric shoe soles and polyester boat hulls.

REFERENCES:
patent: 2811408 (1957-10-01), Braley
patent: 3020260 (1962-02-01), Nelson
patent: 3341646 (1967-09-01), Britain
patent: 3485662 (1969-12-01), Metevia
patent: 3684756 (1972-08-01), Brooks
patent: 3914369 (1975-10-01), Modic et al.
patent: 3983298 (1976-09-01), Hahn et al.
patent: 4057596 (1977-11-01), Takamizawa et al.
patent: 4123604 (1978-10-01), Sandford, Jr.

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