Molding process for encapsulating semiconductor devices using a

Details Molding process for encapsulating semiconductor devices using a Molding process for encapsulating semiconductor devices using a

1990-07-30

1991-02-26

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

174 525, 26427217, H01L 2156, H01L 2328

Patent

active

049961705

ABSTRACT:
An improved molding process utilizes a thixotropic compound. The thixotropic compound is transferred from a feed pot to a manifold having at least one outlet. The manifold is held at a temperature in which the thixotropic compound is not cured. The manifold is engaged with a mold that has an inlet opening that runs to a mold cavity, such that the outlet of the manifold and the inlet of the mold communicate with each other. The thixotropic compound is transferred from the manifold into the mold cavity, which is held at a temperature at which the thixotropic compound is cured. The manifold and the mold are then separated, drawing the thixotropic compound near the exit of the feed runners into the manifold, thus making a clean separation.

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