Molding process and device therefor

Details Molding process and device therefor Molding process and device therefor

1987-12-17

1989-10-17

Thurlow, Jeffery

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

264 63, 264 66, 264137, 264258, 264324, 264327, 264DIG46, 264DIG65, 425398, 425411, 425415, 425DIG110, B29C 4318, B29C 4336, B29C 4352

Patent

active

048745642

ABSTRACT:
A molding process of a molding compound containing an ingredient such as a binder, e.g., pitch or a thermosetting resin which generate gas before being set, is disclosed, wherein the molding compound is heated and molded under pressure according to a special temperature pattern. First, the molding compound may be preheated substantially uniformly to a temperature at which the binder melts and generates reaction gas. Next, temperature gradient in the direction of thickness of the molding is created while raising the temperature of the molding to an upper limit temperature so that the setting of the molding progressively advances from the higher temperature to the lower temperature side of the molding.

REFERENCES:
patent: 2550687 (1951-05-01), Goss
patent: 3009863 (1961-11-01), Angevine
patent: 3504065 (1970-03-01), Edstrom
patent: 3734797 (1973-05-01), Byers
patent: 3790650 (1974-02-01), Heier
patent: 3932568 (1976-01-01), Watts et al.
patent: 4185055 (1980-01-01), Barrilon et al.
patent: 4353782 (1982-10-01), Lersmacher
patent: 4417872 (1983-11-01), Christner et al.
patent: 4613473 (1986-09-01), Layden et al.
patent: 4745008 (1988-05-01), Plotzker et al.

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