Plastic and nonmetallic article shaping or treating: processes – Carbonizing to form article – Agglomeration or accretion
Patent
1981-10-16
1984-01-03
Anderson, Philip E.
Plastic and nonmetallic article shaping or treating: processes
Carbonizing to form article
Agglomeration or accretion
264 454, 264 455, 264 51, 425 4R, B29D 2700, B05D 106
Patent
active
044241771
ABSTRACT:
An article having a relatively lower density polystyrene core and a relatively higher density polystyrene skin is prepared by a method in which a mold is supplied, simultaneously and/or sequentially with electrostatically charged prepuffs of a relatively higher density polystyrene and relatively uncharged low density prepuffs. The walls of the metal mold preferentially attract the electrostatically charged particles. The uncharged lower density prepuffs concentrate at the core. The thus filled mold is subjected to the heating and cooling cycle to provide a molded article having a core with a lower density than the skin.
REFERENCES:
patent: 2451934 (1948-10-01), Evans
patent: 2920679 (1960-01-01), Sittel
patent: 2954589 (1960-10-01), Brown
patent: 3187381 (1965-06-01), Britten
patent: 3278656 (1966-10-01), Dicks et al.
patent: 3374500 (1968-03-01), Drenning
patent: 3478387 (1969-11-01), Ruekberg
patent: 3488411 (1970-01-01), Goldman
patent: 3491170 (1970-01-01), Roe, Jr.
patent: 3607998 (1971-09-01), Goodridge
patent: 3660547 (1972-05-01), Ruekberg
patent: 3833692 (1974-09-01), Szatkowski
patent: 3943212 (1976-03-01), Szatkowski
Anderson Philip E.
Atlantic Richfield Company
Kozak Dennis M.
LandOfFree
Molding prepuffed polystyrene for higher density skin does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molding prepuffed polystyrene for higher density skin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding prepuffed polystyrene for higher density skin will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1031506