Molding polyamide composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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524406, 524430, 524494, 524496, 524606, 525432, C08L 7700, C08K 336, C08K 334, C08K 310

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active

046070737

ABSTRACT:
Disclosed is a molding reinforced polyamide composition comprising [A] a polyamide selected from a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 77 mole % of terephthalic acid component units and 23 to 40 mole % of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) 1,6-diaminohexane units and a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 100 mole % of terephthalic acid component units and 0 to 40 mole % of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) units of a linear aliphatic alkylene-diamine component having 7 to 18 carbon atoms, and [B] a filler in an amount of 0.5 to 200 parts by weight per 100 parts by weight of said polyamide.
This composition has excellent heat resistance characteristics, mechanical properties, chemical and physical properties and molding characteristics in combination.

REFERENCES:
patent: Re28646 (1975-12-01), Hedrick et al.
patent: 3382216 (1968-05-01), Blaschke et al.
patent: 3843611 (1974-10-01), Campbell
patent: 3941755 (1976-03-01), Chapman et al.
patent: 4476280 (1984-10-01), Poppe et al.
patent: 4518728 (1985-05-01), Pollard

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