Molding of resinous embossing elements for greeting cards

Details Molding of resinous embossing elements for greeting cards Molding of resinous embossing elements for greeting cards

1983-10-17

1986-04-01

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

With step of making mold or mold shaping, per se

Utilizing surface to be reproduced as an impression pattern

264219, 264226, 264293, 264337, 264338, B29C 3342, B29C 5902

Patent

active

045797080

ABSTRACT:
A method of forming a resinous embossing plate adapted for use in an embossing and diecutting press for embossing a design onto paper greeting cards. The method comprises providing a line sketch of a design, making a photographic negative of the line sketch, and using the negative to apply the line sketch to both sides of a thin sheet of soft embossable material. Manual indenting of the design into the embossable sheet to provide a female matrix on one side of the embossable sheet. The embossed sheet is then reversed, so that the male portion of the matrix design faces upwardly, and disposed in a mold enclosure. Liquid plastic and fibrous reinforcing material is added to form a relatively low cost embossing plate. Plastic negative of the embossing plate is used in the press in conjunction with the embossing plate, for embossing the design onto the paper greeting card stock.

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