Molding of polypropylene with enhanced reheat characteristics

Stock material or miscellaneous articles – Hollow or container type article – Polymer or resin containing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C264S535000, C264S211240, C264S322000

Reexamination Certificate

active

10387600

ABSTRACT:
Bottles, containers and other articles are formed from polypropylene compositions that include a reheating agent, such as antimony, carbon black, graphite, titanium, copper, manganese, iron, tungsten, graphite, infra-red absorbing dyes or other infra-red absorbing material. The reheating time for the polypropylene composition is shortened for injection stretch blow molding or thermoforming, and the polypropylene granule composition with reheating agent has an L* value of at least 80% of the L* value for a polypropylene granule control without added reheating agents as measured by the Gardner color test. The reheating agent may be incorporated into the polypropylene composition by in situ chemical reduction of a metal compound, such as antimony triglycolate, with a reducing agent, such as hypophosphorous acid. In addition, the polypropylene composition with reheating agent may be derived from a polypropylene masterbatch with high concentrations of reheating agent.

REFERENCES:
patent: 3264225 (1966-08-01), Callahan
patent: 3294885 (1966-12-01), Cines et al.
patent: 3406135 (1968-10-01), Hecker et al.
patent: 3492151 (1970-01-01), Cescon
patent: 3891599 (1975-06-01), Marciniak et al.
patent: 3951886 (1976-04-01), Miyake et al.
patent: 3960819 (1976-06-01), Jones et al.
patent: 3997503 (1976-12-01), Henman et al.
patent: 4224263 (1980-09-01), Kontz
patent: 4328139 (1982-05-01), Simons
patent: 4408004 (1983-10-01), Pengilly
patent: 4456719 (1984-06-01), Yamamoto et al.
patent: 4476272 (1984-10-01), Pengilly
patent: 4535118 (1985-08-01), Pengilly
patent: 4963086 (1990-10-01), Wiatt et al.
patent: 5121828 (1992-06-01), Wiatt et al.
patent: 5185163 (1993-02-01), Wiatt et al.
patent: 5286540 (1994-02-01), Suga et al.
patent: 5419936 (1995-05-01), Tindale
patent: 5456719 (1995-10-01), Keller
patent: 5529744 (1996-06-01), Tindale
patent: 5620650 (1997-04-01), Nakajima et al.
patent: 5679306 (1997-10-01), Nakajima et al.
patent: 5798433 (1998-08-01), Schmidt et al.
patent: 5886088 (1999-03-01), Matsumoto et al.
patent: 5925710 (1999-07-01), Wu et al.
patent: 5941054 (1999-08-01), Valyi
patent: 6022920 (2000-02-01), Maxwell et al.
patent: 6034167 (2000-03-01), Tung et al.
patent: 6159567 (2000-12-01), Charlier et al.
patent: 6197851 (2001-03-01), Maxwell et al.
patent: 6200659 (2001-03-01), Fujimori et al.
patent: 6258313 (2001-07-01), Gottlieb et al.
patent: 6503586 (2003-01-01), Wu et al.
patent: 2002/0086970 (2002-07-01), Cho et al.
patent: 0 429 311 (1991-05-01), None
patent: 429311 (1998-01-01), None
patent: WO 99/48775 (1999-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Molding of polypropylene with enhanced reheat characteristics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding of polypropylene with enhanced reheat characteristics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding of polypropylene with enhanced reheat characteristics will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3851651

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.