Molding method

Details Molding method Molding method

1976-08-17

1978-10-24

Rutledge, L. Dewayne

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 383, 106 3835, 264 82, 264 85, C04B 3100

Patent

active

041219422

ABSTRACT:
The present invention relates to a molding process using a silicate binder substantially based upon an alkali silicate having a higher molecular ratio of silica to alkali. More particularly, it relates to improvements in a molding process, wherein the mold and core are cured by gassing with exceedingly diluted CO.sub.2 and the CO.sub.2 gas consumption for the curing of the molds is reduced to between about 1/2 - 1/20 compared with that of the conventional CO.sub.2 curing process. The resulting molds and cores exhibit an excellent collapsibility after casting, develop no harmful gas in curing and casting procedures, and the used waste sands do not cause any serious soil or water pollution problems.

REFERENCES:
patent: 2883723 (1959-04-01), Moore et al.
patent: 2905563 (1959-09-01), Ilenda et al.
patent: 2952553 (1960-09-01), Ilenda et al.
patent: 2997758 (1961-08-01), Tiberg et al.
patent: 3074802 (1963-01-01), Alexander et al.
patent: 3218683 (1965-11-01), Nishiyama et al.

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