Molding materials

Details Molding materials Molding materials

1992-03-30

1993-01-26

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Polymers from only ethylenic monomers or processes of...

C08F22014

Patent

active

051823527

ABSTRACT:
Molding materials of this invention comprise copolymers consisting essentially of 10 to 30% by weight of .alpha.-methylstryene units. 40 to 70% by weight of methyl methacrylate and 10 to 30% by weight of stryene units with a weight average molecular weight in the range from 50,000 to 200,000, a melt flow rate (MFR) in the range from 4 to 18 g./10 min. at 220.degree. C. under a 10-kg load, and a Vicat softening point of 130.degree. C. or more, show a high degree of transparency, good heat and weather resistance and good moldability and are best suited for such uses as automotive and electrical parts.

REFERENCES:
patent: 3072622 (0963-01-01), Hain
patent: 3080348 (1963-03-01), Lang et al.
patent: 3135723 (1964-06-01), Vandegaer
patent: 3427275 (1969-02-01), Davis et al.
patent: 3466269 (1969-09-01), Fivel
patent: 3629211 (1971-12-01), Nazaki
patent: 3681305 (1972-08-01), Tirpak et al.
patent: 4001484 (1977-01-01), Song
patent: 4086410 (1978-04-01), Song
patent: 4137389 (1979-01-01), Wingler et al.
patent: 4237257 (1980-12-01), Moriya et al.
patent: 4327202 (1982-04-01), Foley, Jr.
patent: 4439589 (1984-03-01), Alberts et al.
patent: 4529787 (1985-07-01), Schmidt et al.
patent: 4533689 (1985-08-01), Tayoma et al.
patent: 4782127 (1988-11-01), Van Nuffel

Affiliated with

Also associated with

Rating

Molding materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1413274