Molding material for electroconductive IC parts

Details Molding material for electroconductive IC parts Molding material for electroconductive IC parts

1989-08-15

1991-12-24

Barr, Josphine

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

H01B 106

Patent

active

050750356

ABSTRACT:
A molding material for electroconductive IC parts is here provided which has a preferable heat distortion temperature (heat resistance) and a desirable melt flow index (moldability) and which supplies molded articles having a suitable surface specific resistance. The above-mentioned molding material comprises 50% by weight or more of a polyphenylene ether resin, electroconductive carbon, an acid imide compound which can be used depending upon an intrinsic viscosity of the polyphenylene ether resin, a high-impact polystyrene resin and an A--B--A' type block copolymer elastomer.

REFERENCES:
patent: 4404125 (1983-09-01), Abolins et al.
patent: 5004561 (1991-04-01), Nomura et al.
Chemical Abstracts, vol. 105, No. 20, abstract no. 173777y, Columbus, Ohio USA.

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