Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent
1995-09-19
1997-06-03
Nguyen, Khanh P.
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Opposed registering coacting female molds
425117, 425544, 425588, 425DIG228, 26427217, B29C 4502, B29C 4526
Patent
active
056352204
ABSTRACT:
A molding die for sealing a semiconductor element with a resin includes an upper and a lower mold half. A leadframe having a resin passage aperture is sandwiched between the lower mold half and the upper mold half. The lower mold half has a lower runner space, a lower cavity, and a lower gate provided between the lower runner space and the lower cavity. The upper mold half has an upper resin well, an upper cavity, and an upper gate provided between the resin well and the upper cavity. The length of the upper resin well in the direction of the flow of resin is equal to or greater than the distance from the lower gate to the front edge of a lower runner rising slope, to thereby obtain a final product which is free from resin burrs formed in the upper resin well.
REFERENCES:
patent: 5197183 (1993-03-01), Chia et al.
patent: 5204122 (1993-04-01), Konishi
Azuma Kousuke
Inaba Takehito
Izumi Atsuhiko
NEC Corporation
Nguyen Khanh P.
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